Gigabyte B760M Gaming X AX DDR4 WiFi6E M-ATX Motherboard

Features: Supports Intel Core 14th/ 13th /12th processors Unparalleled Performance：Hybrid 8+1+1 Phases Digital VRM Solution Dual Channel DDR4：4*DIMMs XMP Memory Module Support Next Generation Storage：2*PCIe 4.0 x4 M.2 Connectors Advanced Thermal Design & M.2 Thermal Guard ：To Ensure VRM Power Stability & M.2 SSD Performance EZ-Latch：PCIe 4.0×16 Slot with Quick Release Design Fast Networks：2.5GbE LAN & Wi-Fi 6E 802.11ax Extended Connectivity：Front USB-C® 10Gb/s, DP, HDMI Smart Fan 6：Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP Q-Flash Plus：Update BIOS Without Installing the CPU, Memory and Graphics Card UNPARALLELED PERFORMANCE With the fast-moving technology changes, GIGABYTE always follows the latest trends and provides customers with advanced features and latest technologies. GIGABYTE motherboards are equipped with upgraded power solution, latest storage standards and outstanding connectivity to enable optimized performance for gaming. Outstanding Thermal Design GIGABYTE Motherboards’ Un-throttled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming performance. PCIe 4.0 Design GIGABYTE B760 Motherboards are ready to work with the PCIe 4.0 devices which are expected to experience triple bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance. Support for DDR4 XMP Up to 5333MHz and Beyond GIGABYTE is offering a tested and proven platform that ensures proper compatibility with profiles up to 5333MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their GIGABYTE otherboard Dual PCIe 4.0 x4 M.2 GIGABYTE Motherboards are focused on delivering M.2 technology to enthusiasts who want to maximize their system’s potential. GIGABYTE PerfDrive PerfDrive technology integrates multiple GIGABYTE exclusive BIOS settings to allow users to balance between different levels of performance, power consumption, and temperature according to their needs easily when using 13th gen Intel Core processors. Real One-piece Build TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design. Multi-Cut Design TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance 802.11ax Wi-Fi 6E Latest Wireless solution 802.11ax Wi-Fi 6E with new dedicated 6GHz band, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission. Dedicated spectrum in 6GHz band for less interference 5.5X throughput than 802.11ac 1×1* 4X better network capacity, no traffic jams especially in those dense area with lots of devices Network efficiency increase for better user experience Connecting the Future – Front USB3.2 Gen 2 Type-C USB 3.2 Gen 2 provides USB 3.2 Gen 2 ports with speeds up to 10Gbps. With twice the bandwidth compared to its previous generation as well as backwards compatibility with USB 2.0 and USB 3.2 Gen1, the much improved USB 3.2 Gen 2 protocol is available over the new reversible USB Type-C and the traditional USB Type-A connector for better compatibility over a wider range of devices. High-End Audio Capacitors GIGABYTE motherboards use high-end audio capacitors. These high quality capacitors help deliver high resolution and high fidelity audio to provide the most realistic sound effects for gamers. Audio Noise Guard GIGABYTE motherboards feature an audio noise guard that essentially separates the board’s sensitive analog audio components from potential noise pollution at the PCB level