AMD Ryzen 7 5800X3D Processor 10th Anniversary Edition With Carbice Ice Pad
MPN 100-100000651POF · Brand AMD
The AMD Ryzen 7 5800X3D 10th Anniversary Edition features 8 Zen 3 cores, 96 MB of L3 cache via 3D V-Cache technology, a 4.5 GHz max boost clock, and comes bundled with a Carbice Ice Pad — all in the AM4 socket
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Overview
The AMD Ryzen 7 5800X3D 10th Anniversary Edition is a desktop processor built for the AM4 platform, featuring AMD's 3D V-Cache technology — a stacked cache architecture that dramatically expands the total L3 cache available to the CPU cores. This special 10th Anniversary Edition includes a Carbice Ice Pad, a carbon-nanotube-based thermal interface material designed to improve heat transfer between the processor and cooler, an accessory not found in the standard retail box. At its core, the Ryzen 7 5800X3D pairs eight Zen 3 CPU cores with simultaneous multi-threading (SMT) to deliver 16 processing threads. The base clock runs at 3.4 GHz, with Precision Boost 2 technology able to push individual cores up to 4.5 GHz under favourable conditions. With a combined cache of 512 KB L1, 4 MB L2, and 96 MB L3, the processor maintains an unusually large working dataset in chip memory, which is particularly beneficial in games and latency-sensitive workloads. The chip requires no integrated graphics, so a discrete GPU is mandatory. It slots into any AM4 motherboard and is compatible with X570, X470, B550, B450, and A520 chipsets. PCIe 4.0 lanes are available on X570 and B550 boards. The processor supports up to 128 GB of DDR4 UDIMM memory across two channels, with peak validated speeds of DDR4-3200 in a two-DIMM configuration. ECC memory is supported when the motherboard also provides that capability. No CPU cooler is included in the box, so a high-performance aftermarket cooler is necessary given the 105 W TDP. Maximum junction temperature (Tjmax) is rated at 90 °C. The CPU cores are manufactured on TSMC's 7 nm FinFET process, while the I/O die uses a 12 nm GlobalFoundries process node. Warranty coverage is three years from AMD. Verified Specifications: - Cores / Threads: 8 / 16 - Base Clock: 3.4 GHz | Max Boost Clock: up to 4.5 GHz - L1 Cache: 512 KB | L2 Cache: 4 MB | L3 Cache: 96 MB (total) - Architecture: Zen 3 (codename Vermeer) - Process Node: TSMC 7 nm FinFET (CCD) / 12 nm GlobalFoundries (IOD) - TDP: 105 W | Tjmax: 90 °C - Socket: AM4 | Compatible Chipsets: X570, X470, B550, B450, A520 - Memory: DDR4, dual-channel, up to 128 GB, DDR4-3200 (2-DIMM 1R/2R) - PCIe Version: 4.0 (on X570 / B550) - Integrated Graphics: None - CPU Cooler: Not included | Carbice Ice Pad: Included (10th Anniversary Edition) - Warranty: 3 Years - SKU / Model No.: 100-100000651POF
Datasheet
| Memory Type | DDR4 |
|---|---|
| Warranty | 3 Years |
| Socket | AM4 |
| Cores | 8 |
| Threads | 16 |
| TDP | 105W |
| Cache | 100 MB |
| CPU Type | Ryzen 7 |
| Max Memory | 128 GB |
| Model | Ryzen 5 5800X3D ( 10th Anniversary Edition ) |
| L1 Cache | 512KB |
| L2 Cache | 4MB |
| Platform | Desktop |
| Model No. | 100-100000651POF |
| Base Clock | 3.4GHz |
| *Os Support | Windows 11 – 64-Bit EditionWindows 10 – 64-Bit Edition RHELx86 64-BitUbuntu x86 64-Bit*Operating System (OS) support will vary by manufacturer |
| ECC Support | Yes (Requires mobo support) |
| Architecture | “Zen 3” |
| Consumer Use | Yes |
| NVME Support | Boot, RAID0, RAID1, RAID10 |
| Product Line | AMD Ryzen™ 7 Desktop Processors |
| Socket Count | 1P |
| Commercial Use | No |
| Integrated Graphics | No |
| Market Segment | Enthusiast Desktop |
| Product Family | AMD Ryzen™ Processors |
| Former Codename | “Vermeer” |
| Instruction Set | x86-64 |
| Memory Channels | 2 |
| Max Memory Speed | 2x1R DDR4-32002x2R DDR4-32004x1R DDR4-29334x2R DDR4-2667 |
| Boost Clock | Up to 4.5GHz |
| Native Sata Ports | 2 |
| Package Die Count | 1 |
| I/O Die (Iod) Size | 125mm² |
| Supporting Chipsets | X570X470B550B450A520 |
| CPU Boost Technology | Precision Boost 2 |
| Multithreading (Smt) | Yes |
| Supported Extensions | AES, AMD-V, AVX, AVX2, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64 |
| USB Type-C® Support | Yes |
| Pci Express® Version | PCIe 4.0 |
| System Memory Subtype | UDIMM |
| Supported Technologies | Windows® 11 GamingAMD StoreMI TechnologyAMD “Zen 3” Core ArchitectureAMD Ryzen™ VR-Ready Premium |
| CPU Cooler Included | Not included |
| CPU Compute Die (Ccd) Size | 74mm² |
| Native USB 2.0 (480Mbps) Ports | 0 |
| Processor Technology For I/O Die | 12nm (Globalfoundries) |
| Max. Operating Temperature (Tjmax) | 90°C |
| Native Pcie® Lanes (Total/Usable) | 24/20 |
| Native USB 3.2 Gen 1 (5Gbps) Ports | 0 |
| Processor Technology For CPU Cores | TSMC 7nm FinFET |
| Native USB 3.2 Gen 2 (10Gbps) Ports | 4 |
| Additional Usable PCIE Lanes From Motherboard | AMD X570 16x Gen 4AMD X470 2x Gen 3AMD X470 8x Gen 2 |
| Speed | 3.4 GHz |
| Series | 5000 Series |
| Unlocked | Yes |
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