Thermal Grizzly Conductonaut 1g Liquid Metal CPU Paste

The Thermal Grizzly Conductonaut is a liquid metal thermal compound formulated for high-efficiency CPU cooling applications. Based on a eutectic alloy of tin, gallium, and indium, it achieves an exceptionally high thermal conductivity that standard silicone-based pastes cannot match. The compound is designed for experienced users who want to push cooling performance to its limits — whether on heavily overclocked desktop processors or thermally constrained laptops where die temperatures need aggressive management. The eutectic alloy formulation means the compound remains in a stable, low-viscosity liquid state during operation, filling microscopic surface imperfections on both the CPU heat spreader and cooler base for minimal thermal resistance. The increased indium content in the alloy contributes to both elevated thermal conductivity and long-term stability, reducing the risk of separation or degradation over time. Application is facilitated by the included plastic needle syringe, which allows precise, controlled dispensing to avoid excess spillage onto electrically sensitive areas of the motherboard or socket. Because Conductonaut is electrically conductive, it must only be applied by users who are comfortable protecting surrounding components from contact. It is not suitable for use on nickel-plated or aluminium heat spreaders without first verifying material compatibility, as gallium-based alloys can corrode certain metals. Copper and direct-die applications are the primary recommended use cases. This 1g syringe (SKU: TG-C-001-R) contains sufficient compound for one to two careful applications, depending on die size. Verified Specifications: • Thermal Conductivity: 73 W/mK • Viscosity: 0.0021 Pa·s • Density: 6.24 g/cm³ • Operating Temperature Range: −10 °C to +140 °C • Contents: 1 g • Alloy Composition: Tin, Gallium, Indium (eutectic blend) • Warranty: 1 Year • Application Tool: Plastic needle syringe included